About Us

Quanstar Technologies Company Limited (QST) is an established leader in global manufacturing, consistently delivering cutting-edge solutions. With a proven track record, we are committed to pushing the boundaries of innovation in the electronics industry

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Contacts

2703 Building B, 33/4 phra, Ram 9 Rd., Huai Khwang, Bangkok 13010

contact@qstcircuit.com

+1 -800-456-478-23

// who we are

Shaping the Future of
Global Manufacturing

QST is a global leader in high-performance PCB manufacturing. We specialize in delivering innovative, precise, and scalable solutions tailored for the automotive, electronics, consumer, and defense sectors. Our comprehensive services span from custom product design to advanced production, enabling our clients to achieve their technological objectives. Our value proposition is defined by cost-effective solutions, rapid technical support, and expedited lead times.

Innovating Beyond Boundaries

Our Mission

Our Philosophy

Our Vision

Our Strategy

// Experience. Execution. Excellence.

What We Actually Do

QST: Your Integrated Manufacturing Partner We seamlessly integrate with your operations, functioning as an extension of your team.

Design & Engineering Collaboration: We collaborate with your design engineers during the new product introduction (NPI) phase, leveraging our extensive manufacturing expertise to optimize designs for manufacturability (DFM).

Supply Chain Integration: We interface directly with your manufacturing cells, providing integrated assembly solutions and just-in-time (JIT) delivery to streamline your production flow.

Continuous Improvement: We implement continuous improvement programs and share the benefits of process efficiencies and yield enhancements directly with your organization.

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Our Core Areas:

High-Quality PCB Manufacturing – delivering advanced and reliable solutions
Capacity Expansion & Global Presence – scaling operations across Thailand, India, and Taiwan
Product Innovation – aluminium & flexible PCB technologies for next-gen applications
Strategic Alliances & Market Penetration – building partnerships to strengthen global leadership

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QST exists to reinforce global manufacturing leadership in electronics by delivering cutting-edge PCB solutions and continually expanding capacity and reach. From our strong base in Thailand, we pursue innovation at scale—so our operational capabilities and global presence keep evolving in step with market demand. Through significant capacity expansion and strategic market penetration, we aim to transform how reliably and rapidly advanced PCBs reach the world.

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Our Mission

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We envision QST as a market leader in the PCB industry, recognized for a broader product portfolio, world-class quality, and a truly international footprint. As a cornerstone of this future, we are preparing for our transformation into a public limited company by 2029—a key step that aligns governance, transparency, and capital access with our global leadership ambitions. Our trajectory is clear: expand capabilities, deepen market trust, and scale responsibly to set the standard in advanced electronics manufacturing.

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Our Vision

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Growth with purpose. We believe leadership is earned by pairing innovation with discipline—expanding where it strengthens customers, partnering where it accelerates value, and evolving our structure to uphold trust. Partnership-led expansion: Build collaborative alliances (including in Taiwan) to unlock speed, resilience, and technology depth. Proximity to markets: Establish a Registered Branch office in India to serve a vital market with local accountability. Transparency & governance: Evolve into a public limited company (by 2029) to match our scale with stakeholder confidence. Product breadth as an advantage: Broaden our PCB portfolio so customers can innovate across more applications, faster.

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Our Philosophy

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We’re executing a focused plan to scale our footprint, products, and market access. Capacity will expand from 200,000 m² to 500,000 m² within five months, with a new India office this year and public company readiness by 2029. Next year, 50–60% investment in Taiwan and strategic alliances will strengthen supply chains and technology. By Q1 2026, advanced aluminium and flexible PCB manufacturing will launch, enabling high-performance solutions. Strategic market expansion will align this growth with global customer demand and leadership goals.

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Our Strategy

// technology index

Improve and Innovate with Next-Gen Manufacturing

At QST, we are shaping the future of electronics with advanced PCB technologies, global expansion, and a commitment to innovation. We empower businesses by delivering reliable, scalable, and cutting-edge manufacturing solutions tailored to evolving industry needs.

PCB Manufacturing Excellence 90%

Capacity Expansion & Global Operations 85%

Product Innovation & R&D 70%

Customer-Centric Solutions 95%

Our Process	Process Capabilities
CCL Type	Material Types: FR4 Tg140; FR4 Tg150; FR4 Tg170; Lead-free; Halogen-free; Mid Loss/Low Loss/Very Loss (TG>=170); RO4350B/RO3003
Product Type	PCB Type: Through-hole PCB: HDI; High frequency mixed voltage
Layer	Layers: 2-32L
Max Size	Thickness (Depending on used material type): Rigid: 0.37mm Flex: 0.15mm Rigid-Flex: 0.4mm
Min board thickness	Other Thickness/Dimensions: 0.47mm
Board THK Min	0.05mm
Inner Core THK	2/2mil
Inner Min LineWidth/Space	Through Hole: 0.1mm
Min Hole Size	Aspect Ratio: 16:1
Aspect Ratio of Copper Plating	Spacing/Trace: 2/2mil
Outer Min Line Width/Space	Tolerance: +/- 8% +/- 5%
Line Width Tolerance	Solder Mask Thickness:
Impedance Tolerance	Green: 3mil
Min Soldering Bridge Width	Parti-color: 3.5mil
Max Finished Board Copper THK	Copper Weight/Voltage: <=6oz (3000V)
Surface Finish	Surface Finishes: HASL lead free / HASL lead free +G/F/OSP/OSP+G/F/OSP + Carbon /Immersion Au/Immersion Au +G/F/Selective Immersion Au / ENEPIG/Immersion Tin
Other special processes	Manufacturing Processes: Deep milling/drilling, back drilling, CCD forming, buried copper block, high fre-quency mixed pressure, HDI.

Layer Count	1-40L Rigid, HDI and High Frequency
Finished board thickness	Tolerance: 0.47mm-7.0mm, +/-10% Core thickness (min for inner layer): 0.05mm
Base Copper Thickness	Outer layer: 6 oz multiple, 2 L with 12oz. Inner layer: 10 oz
Max. Production Panel	Size 1000mm*13000mm.
Max. PCB Size	800mm X 13000mm
Min. Line Width/Line Space	0.075mm X 0.075mm
Min. Hole Size (finished). Mechanical Laser	0.15mm 0.05mm
Laminate Main Brands: Shengyi, KB, Ventec, ITEQ, Panasonic, Rogers, Wangling, Taconic	CT1 >= 600. BT epoxy FR4 PTFE Ceramic High frequency materials High Speed materials
Surface Finish	HAL (leadfree) DOSP Immersion Nickel Gold Peel able solder mask Galvanic Nickel Gold Gold Finger Immersion Tin Carbon Ink Print Immersion Silver
Additional Technology	HDI boards (micro via, blind via, buried via) Resin plugging of via holes, copper plugging of micro via Press-fit hole

Parti-colour 4mil	Metal Layers: 4 Layer Copper 6oz
Finished Board Thickness	Availability: On request
MAX. PCB Size	Material Dependency: Depending on used material type
Bow & Twist	Tolerance/Percentage: 0.7%
Minimum Line Width/ Line Space	Thickness/Dimension: 0.1mm
Laminate	Main brands: Ventek, Totking, BOYU
Solder Mask Color Main brands: Tamura, Taiyo, OTC, Huntsman	Colors (Green): (Glossy, Semi-Matte, Matte) Blue Black Red White Yellow
Surface Finish	HAL(leadfree) Immersion Nickel Gold Immersion Tin Immersion Silver Immersion Ni/Au+OSP Golden-Finger+imm.Ni/Au
Profiling	Routing Punching Manufacturing Process: V-Scoring, Jump V-Scoring (copper substrate on request)

Technology	Alu Oxide, Alu Nitride
Layer Count	Item: s4
Finished board thickness	Max Production Panel size: 1000mm * 13000mm
anel Size	Size Width: 800mm Size Length: 13000mm Dimension: drilling to Tolerance
Dimension Tolerance	Tolerance ≤±50um
Min. hole size	>=0.1mm
Line width/spacing	≥75/75um
Hole filling capacity of electroplating	Aspect Ratio: 5:1
Outline tolerance	Tolerance 4: ±0.1mm
Conductor thickness	Range: 10-210um
Thermal Conductivity	Al203: 20-24W/m.K ALN: 170-220W/m.K
Laminate	Main brands: HUAQING, Curamik, Coostek
Surface Finish	HAL (leadfree) OSP Immersion Nickel Gold ENEPIG Immersion Tin Immersion Silver